power ring film capac itors tm at the leading edge of film capacitor technology ? ul recognized part series 777d sbe part 777D10896-108 sbe reserves the right to amend design data power ring film capacitor? 1000 f, 600 vdc the 777D10896-108 power ring is a ul recognized 600vdc, 1000 f dc link capacitor with an esr of 125 micro-ohms at 20khz and an esl of less than 5nh. electrical specifcations sbe part #: 777D10896-108 capacitance/tolerance: 1000 f 10% dc voltage ratng: 600 v dc dielectric/constructon : me tallized polypropylene. single secton design dielectric withstand: units 100% t ested at dc potental of 750 volts for two minutes at 25 c ul recogniton: ul810 ul file #: e364956 typical esr vs. frequency: power ring film capacitors ? sbe part #: 700d10896-348 power ring film capacitor? 1000 f, 600 vdc electrical specifications sbe part #: 700d10896-348 capacitance/tolerance: 1000 f 10% dc voltage rating: 600 vdc dielectric/construction: metallized polypropylene. single section design, non-inductively wound dielectric withstand: unit shall withstand a dc potential of 750 volts for two minutes insulation resistance: 100 m min at +25 c esr vs. frequency: 0 0.5 1 1.5 2 esr, milliohms 0.01 0.1 1 10 100 1000 frequency, khz esl: less than 5 nh in a suitable laminar bus structure operatng temperature: -40 c to +85 c at full dc voltage ratng voltage, temperature contact sbe for applicatons de-ratng: above 85 c system fault current 10,000 amps maximum ratng (external to the capacitor): rms current ratng: 0 100 200 300 400 500 600 25 30 35 40 45 50 55 60 65 70 75 maximum ripple current (arms) case temperature ( o c) 75c hotspot 50 fit (1 x rated v) 427arms at 50c case temperature
power ring film capac itors tm sbe inc. 81 parker road telephone: 802.476.4146 web site: www.sbelectronics.com barre, vermont 05641 usa fax: 802.661.3950 e-mail: powerring@sbelectronics.com ul recognized part series 777d sbe part 777D10896-108 sbe reserves the right to amend design data thermal specifcations here are two representatons of capacitor surface temperature over time for two specifc thermal resistances of 1c/w and 0.5c/w. notes regarding these graphs: ? the thermal resistance is that from capacitor to applicaton. this is a functon of the applicaton environment, not the capacitor itself. ? the capacitor can handle extreme current for small duty ratos. trise occurs very slowly. this is because the capacitor has a high specifc heat. ? these charts can be adapted for other currents by multplying y axis values for any tme by (iapp/200)2 ? internal capacitor trise is added to the capacitor surface/terminal temperature. ? terminals are assumed to be at case temperature. mechanical specifcations dimensions: refer to layout details terminals: tin pla ted copper, 0.032 thick encapsulaton: r tv case - ul 94-v0 marking: sbe inc. sbe company identfcaton 777d108 sbe short form part number 1000 f 10% capacit ance value and tolerance 600 vdc dc voltage ratng -40c to +85c operatng temperature range yyww-lot#-unit 12-digit serial number (date code, lot number, unit number) ul recogniton logo sample 1. capacitor surface temperature rise above applicaton environment @ 200 amps rms current load, 10 khz. thermal resistance = 0.5c/w: thermal specifications following are two representations of capacitor surface temperature over time for two specific thermal resistances of 1 c/w and 0.5 c/w. notes regarding graphs that follow: 1. the thermal resistance is that from capacitor to application. this is a function of the application environment, not the capacitor itself. 2. the capacitor can handle extreme current for small duty ratios. trise occurs very slowly. this is because the capacitor has a high specific heat. 3. these charts can be adapted for other currents by multiplying y axis values for any time by (iapp/200)2 4. internal capacitor trise is added to the capacitor surface/terminal temperature. 5. for 200 a rms the assumed 10 c internal trise is very conservative based on simulation results and verification measurements. 6. terminals are assumed to be at case temperature. sample 1. capacitor surface temperature rise above application environment @ 200 amps rms current load, 10 khz. thermal resistance = 0.5 c/w: 25 25.5 26 26.5 27 27.5 28 capacitor surface temp. deg c 0 1000 2000 3000 4000 time in seconds sample 2. capacitor surface temperature rise above applicaton environment @ 200 amps rms current load, 10 khz. thermal resistance = 1c/w: sample 2. capacitor surface temperature rise above application environment @ 200 amps rms current load, 10 khz. thermal resistance = 1 c/w: 25 26 27 28 29 30 31 capacitor surfacetemp. deg c 0 2000 4000 6000 8000 time in seconds mechanical specifications dimensions: refer to layout details terminals: nickel plated copper, 0.032 thick encapsulation: polycarbonate outer housing, potted with rtv silicone marking: sbe sbe company identification 700d348 sbe part number 1000 f 10% capacitance value and tolerance 600 vdc dc voltage rating yyww weekly date code (i.e. 0915 = 15 th week of 2009) mechanical mounting and additional thermal notes: this capacitor is optimized for extremely low self inductance when connected to a suitable coplanar bus structure. when so connected, the capacitor is very rigidly attached to such a structure and thus does not necessarily need to be mounted to a chassis. however, the capacitor case can be attached to an application surface/heat sink, etc. if desired. when so mounted, the capacitor can be part of the bus structure support. use of thermal interface compound between the capacitor case and application surface/heat sink will assist with removal of capacitor and bus heat. note that the capacitor internal heat is very small, and other bus structure heat sources are very likely significantly higher than the heat added to the bus by the capacitor. capacitor dissipation is approximately 5w at 200arms, from 1- 100khz. it is highly recommended to use infrared thermal imaging from a system cold start to determine the location and relative magnitude of thermal input to the bus. the capacitor may well function as a thermal conduit for bus structure heat, and it will be very possible that the capacitor internal hot spot is less than the terminal temperature. thermal contour maps are available for some representative conditions.
power ring film capac itors tm at the leading edge of film capacitor technology ? ul recognized part series 777d sbe part 777D10896-108 sbe reserves the right to amend design data mechanical mountng and additonal thermal notes: this capacitor is optmized for extremely low self inductance when connected to a suitable laminar bus structure. the capacitor internal heatng is very small, and other bus structure heat sources are very likely signifcantly higher than the heat added to the bus by the capacitor. capacitor dissipaton is approximately 5w at 200arms, from 1-100khz. it is highly recommended to use infrared thermal imaging from a system cold start to determine the locaton and relatve magnitude of thermal input to the bus. the capacitor may well functon as a thermal conduit for bus structure heat, and it will be very possible that the capacitor internal hot spot is less than the terminal temperature. thermal contour maps are available for some representatve conditons. layout details: contact sbe inc. to discuss your specifc requirements. 7x 45.0 7x 22.5 174.45 bolt circle 222.15 bolt circle 214.00 16x m5x0.8 - 6h thru 28 in-lbs max torque a 0.50 a b c c b 9.21 54.21 1.00 16 surfaces a 16.84 7.11 12.70 25.40 detail a notes: minimum clearance through air: 17.20mm 1. minimum clearance over surfaces: 25.40mm 2. revisions rev. description chg by chk by apr by date 01 initial release - - - - finish do not scale drawing 12/12/2013 msb unless otherwise specified: all dimensions are in mm checked drawn material geometric tolerancing per: y14.5-2009 eng appr. non-toleranced dimensions are basic agh 12/12/2013 12/8/2013 sheet 1 of 1 size a rev sbe, inc. 81 parker road barre, vt 05641 usa 802.476.4146 fax: 802.661.3950 01 1.00 a b c nathan proprietary and confidential the information contained in this drawing is the sole property of sbe. any reproduction in part or as a whole without the written permission of sbe is prohibited. title dwg. no. 777d108lv power ring capacitor, 1000uf, 600vdc
power ring film capac itors tm sbe inc. 81 parker road telephone: 802.476.4146 web site: www.sbelectronics.com barre, vermont 05641 usa fax: 802.661.3950 e-mail: powerring@sbelectronics.com ul recognized part series 777d sbe part 777D10896-108 sbe reserves the right to amend design data advantages of power ring dc link capacitors ? ability to handle higher ripple currents with less capacitance, weight, and volume ? service life of > 200,000 hours for realistc operatng conditons, due to lower losses and beter thermal performance ? minimizaton of igbt overshoot and eliminaton of the need for additonal snubber capacitors ? most efectve isolaton of dc storage or supply from ac switching artfacts ? lowest industry esl at <5nh typical with a properly integrated bus structure ? smaller inverter packaging ? overall system cost savings ? capacitance from 400 f to 2500 f and voltages from 250 vdc to 1200 vdc the sbe power ring film capacitors? utlize traditon - ally available and economical polypropylene and polyester capacitor dielectric flms. however, the power of the shape ? allows for both thermal and electrical performance which has been unachievable in the flm capacitor industry to date. power ring system performance the combinaton of lowest available trise, esr and esl coupled with highest ripple current handling capability enable the development of industry leading inverter designs with unbeatable performance and reliability. lowest available trise for a given ripple current lowest available esl, less than 5nh demonstrated with optmal integrated bus lowest available esr, less than 150 micro-ohms typical crown terminal architecture provides for a multtude of current paths which allows the monolithic capacitor to functon as a distributed element with a much lower esr than an equivalent array of smaller parts. sbe has developed a next generaton capacitor simulaton tool that allows accurate calculaton of hotspot tempera - ture to allow optmal ratng with excellent reliability. integratng the power ring in an existng design the stacked inverter design evolves from modifying a typical automotve inverter by utlizing the excess space lef above the igbt module (fgure 1). by bending the end of the laminar bus plate, the ibgt, die, cooling plate, and the ring capacitor are stacked on top of each other in a symmetrical fashion. the ring capacitor is placed underneath the cooling plate. the cooling plate is shared with the igbt module which is mounted on the top. figure 1 figure 2 figure 2 shows the stacked inverter design afer the integraton of the ring capacitor and the laminar bus plate. by now combining both aspects of vertcal inte - graton and the low temperature rise characteristcs of the capacitors, an increase to 50% or more volume reducton is realistcally possible. these improvements clearly translate into weight and cost reductons. #sbe-pr-108-01/14
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